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Vinod Pangracious

Chair of the Department of Electrical and Computer Engineering and Associate Professor of Electrical Engineering

School of Engineering

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Ph.D. in Electrical Engineering, Sorbonne University Paris VI, France
M.Tech. in Microelectronics,
Indian Institute of Technology, Bombay
B.Tech. in Electronics Engineering, Cochin University of Science and Technology, India

Dr. Pangracious joined AUD in 2014. Prior to that, he was a doctoral researcher at the University of Pierre and Marie Curie Paris VI, France. He earned his undergraduate degree from the Cochin University (’95) and graduate degree from Indian Institute of Technology Bombay (IITB) in 2001. He started his career as a Product Design Engineer at Cypress Semiconductor Inc., CA, USA. In 2004, he moved to Germany and joined Infineon Technologies AG as a Development Engineer. In 2007, he joined Innovative Silicon SA- Switzerland as a Member of the Technical Staff (Principle Design Engineer) and worked with a team of engineers and entrepreneurs to develop Zero Capacitor Memory (ZRAM).

Dr. Pangracious’ teaching and research interests include: Digital hardware development, Multiprocessor system architecture and design, Three-Dimensional Integrated Circuits, VLSI, EDA, Field Programmable Gate Arrays (FPGA), System on a Chip (SoC), Application Specific Integrated Circuits (ASIC), implementation and applications of Artificial Intelligence and machine Learning, and innovation and entrepreneurship. He has authored and co-authored more than 50 publications in reputable journals and conferences. He has served also as a reviewer, review committee member, technical program committee member, program chair, area chair, organizing committee member and steering committee member for multiple international conferences and journals. He has regularly reviewed papers for several journals including the IEEE Transactions NanoBioScience, CPMT (Components, manufacturing and Technology) and VLSI.

Dr. Pangracious is a Member of IEEE and ACM. He is the chair of IEEE CAS, SSCS and PELS UAE chapters. He maintains strong connections with the semiconductor and software industry in the UAE and the Middle East. He is a member of the advisory panel and core committee of the AUD Entrepreneurship and Innovation Center (AEIC).

 

ORCID | Mendeley | Scopus | Researcher ID


Selected Publications:

  • “A Decentralized Autonomous Ecosystem for Peer-To-Peer Clean Energy Trade” 2020 12th Annual Undergraduate Research Conference on Applied Computing (URC) UAE 
  • “Hybrid Three-Dimensional Thermal Aware Design Methodologies For Multiprocessor Systems” 2020 12th Annual Undergraduate Research Conference on Applied Computing (URC) UAE 
  • Advanced Operation for Micro-Grid on Residential Properties for Network Power Stability During Peak Load 2019 International Conference on Electrical and Computing Technologies and Applications (ICECTA) 2019-11, DOI: 10.1109/icecta48151.2019.8959610 
  • Residential Photovoltaic Systems Design for Countries with Planned Regular Outages 2019 International Conference on Electrical and Computing Technologies and Applications (ICECTA) 2019-11 | DOI: 10.1109/icecta48151.2019.8959753 
  • 3D-cool: Design and development of adaptive thermal-aware three-dimensional NoC-based multiprocessor chip 2018-04-17 | DOI: 10.1109/coolchips.2018.8373074 
  • An efficient multi-objective thermal aware routing algorithm 3D network-on-chips2017 International Conference on Electrical and Computing Technologies and Applications, ICECTA 2017 2018 | DOI: 10.1109/ICECTA.2017.8251970 
  • ATAR: An Adaptive Thermal-Aware Routing Algorithm for 3-D Network-on-Chip Systems IEEE Transactions on Components, Packaging and Manufacturing Technology 2018 | journal-article DOI: 10.1109/TCPMT.2018.2842102 
  • “Thermal management in 3D Homogeneous NoC systems using optimized placement of liquid microchannels” Proceedings - IEEE 11th International Symposium on Embedded Multicore/Many-Core Systems-on-Chip, MCSoC 2017 2018 | conference-paper DOI: 10.1109/MCSoC.2017.23 
  • Novel Three-Dimensional Embedded FPGA Technology and Architecture ACM SIGARCH Computer Architecture News 2017-01-11 | journal-article DOI: 10.1145/3039902.3039912 
  • A Bio-Inspired Hybrid Thermal Management Approach for 3-D Network-on-Chip Systems IEEE Transactions on Nanobioscience | journal-article / DOI: 10.1109/TNB.2017.2704280